Huo, FW, Kang, RK, Li, Z, et al. Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers. Int J Mach Tools Manuf 2013; 66: 54 – 65. Google Scholar | Crossref

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Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers A phenomenon commonly encountered in grinding of silicon wafers is …

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Grinding marks are regard as a great obstacle to manufacture spherical and aspheric surfaces with higher surface quality, lower energy and wastage. The scallop-height was studied for optimizing the grinding parameters firstly to reduce its effect on grinding marks. Secondly, the expression of grinding points distribution was established to characterize the grinding marks caused by the radial ...

An electron-withdrawing PZ-T unit is employed to incorporate into the PM6 polymer backbone as the third component, and a series of high-performance D-A 1-D-A 2 type terpolymers are synthesized by random copolymerization strategy. Among them, the …

Origin modeling and suppression of grinding marks in ultra precision grinding of silicon wafers. A phenomenon commonly encountered in grinding of silicon wafers is the grinding marks which are difficult to remove by subsequent polishing process and have been a great obstacle to the manufacture of silicon wafers with higher flatness.

Highlights Grinding marks on silicon wafers are caused by the axial run out of the cup wheel. Grinding marks present multiple angular wavelengths characteristics. A grinding marks formation model was developed. An angular wavelength model of the grinding marks was developed. Grinding marks can be suppressed by reducing the cutting paths aggregation.

Grinding marks is generated on the ground surface after grinding, and it would affect the surface quality, the subsequent polishing process and performance of workpiece. In this paper, the generation mechanism, affecting factors and optimization strategies, and suppression method of grinding marks was summarized. And then, the research trend of grinding marks was pointed out. From the …

,guodongming,, Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers,Dongming Guo :、

Abstract: The effective estimation of the operational reliability of mechanism is a significant challenge in engineering practices, especially when the variance of uncertain factors becomes large. Addressing this challenge, a novel mechanism reliability method via a two-dimensional extreme distribution is …

Article "Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers" Detailed information of the J-GLOBAL is a service based on the concept of Linking, Expanding, and Sparking, linking science and technology information which ...

The rotation speed ratio (RSR) is an important parameter influencing the surface waviness features in the parallel grinding process, which equals the ratio of the grinding wheel's rotation speed N g and the workpiece's rotation speed N w, as described in Equation (3) [].When RSR is integer, the peaks and valleys of the circular waviness profiles generated during all the revolutions of the ...

HCH ultra-fine grinding mill is especially suitable for ultra fine grinding. With years' accumulation of experience in R&D, the HCH Ultra-fine Grinding Mill is a new ultra fine pulverizing equipment designed by Hongcheng. This mill is widely used to grind any non-metal minerals with Moh's hardness below 7 and moisture below 6%, such as talc ...

,Kang Renke,, Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers,Renke Kang Hits: Indexed by: First Author:Huo, F. W. Correspondence Author:Huo, FW (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China.

The wafer grinding by use of fixed abrasive diamond wheels is required to create a high-quality wafer surface in a short time. In general, it is known that the grinding performance of diamond wheel is mainly dependent on grinding wheel specifications and grinding conditions. The cutting edge distribution or abrasive protrusion height in depth-wise of a specified wheel is one of the most ...

An analytical force model for ultra-precision diamond sculpturing of micro-grooves with textured surfaces. International Journal of Mechanical Sciences, 160, 129-139. 12. Sun, Z., To, S., & Yu, K. M. (2019). An investigation in the ultra-precision fly cutting of freeform surfaces on brittle materials with high machining efficiency and low tool ...

Request PDF | On Mar 1, 2013, F.W. Huo and others published Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers | Find, read and cite all the research ...

Origin modeling and suppression of grinding marks in ultra precision grinding of silicon wafers. Asmc Gta Semiconductor Diffusion wafer back-side high energy H implantation FRD P-type deep junction diffusion SIPOS process Front-side thick metal process for press-pack Low voltage High voltage polyimide process Back-side process capability ...

Routine measurement of interstitial oxygen in silicon wafers utilizes infrared absorption at 1107 cm-1 (9.03 µm). This is the absorption band associated with anti-symmetric vibration of SiO2 in the silicon lattice. (7) The infrared beam passes through a wafer sample from the front to the back (Figure 2).

Generation Mechanism of Grinding Marks Based on Grinding Trace Simulations: CHEN Bing 1, LUO Liang 1, JIAO Haowen 1, DENG Zhaohui 1, YAO Honghui 2: 1. Hunan Provincial Key Laboratory of High Efficiency and Precision Machining of Difficult-to-Cut Material, Intelligent Manufacturing Institute, Hunan University of Science and Technology, Xiangtan, Hunan, 411201;

OriginmodelingandsuppressionofgrindingmarksinultraprecisiongrindingofsiliconwafersF.W.HuonR.K.KangZ.LiD.M.GuoKeyLaboratoryforPrecisionandNon ...

Alfares and Elsharkawy [9, 10] refined the model developed by Aini et al. [11] to study the effect of the grinding force and axial preloading of angular contact ball bearings on the dynamic of the ...

Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers F.W. Huon, R.K. Kang, Z. Li, D.M. Guo Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China article info Article history: Received 17 September 2012

Abstract A phenomenon commonly encountered in grinding of silicon wafers is the grinding marks, which are difficult to remove by subsequent polishing process, and have been a great obstacle to the manufacture of silicon wafers with higher flatness. In this paper, the grinding marks formation mechanism was clarified, a grinding marks formation model and an angular wavelength model were ...

Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers FW Huo, RK Kang, Z Li, DM Guo International Journal of Machine Tools and Manufacture 66, 54-65, 2013